Semiconductor devices and methods of manufacturing the same

ABSTRACT

A semiconductor device includes an active fin on a substrate, a gate structure on the active fin, a gate spacer structure on a sidewall of the gate structure, and a source/drain layer on at least a portion of the active fin adjacent the gate spacer structure. The gate spacer structure includes a wet etch stop pattern, an oxygen-containing silicon pattern, and an outgas sing prevention pattern sequentially stacked.

CROSS-REFERENCE TO RELATED APPLICATION

This is a divisional application of U.S. application Ser. No.15/384,834, filed on Dec. 20, 2016, which claims priority under 35 USC §119 to Korean Patent Application No. 10-2016-0003213, filed on Jan. 11,2016, in the Korean Intellectual Property Office (KIPO), the contents ofwhich are herein incorporated by reference in their entirety.

BACKGROUND 1. Field

Example embodiments relate to semiconductor devices and methods ofmanufacturing the same. More particularly, example embodiments relate tosemiconductor devices including spacers on sidewalls of a gatestructure, and methods of manufacturing the same.

2. Description of the Related Art

When a finFET is fabricated, a spacer layer may be formed on a dummygate, the spacer layer may be anisotropically etched to form a spacer ona sidewall of the dummy gate, an upper portion of an active fin adjacentthe dummy gate may be etched using the dummy gate and the spacer as anetching mask to from a recess, and a selective epitaxial growth (SEG)process may be performed to form a source/drain layer in the recess. Thedummy gate may be removed to form an opening, and a gate structure maybe formed in the opening. The spacer may include a proper material forperforming various etching processes and the SEG process.

SUMMARY

Example embodiments provide a semiconductor device having improvedcharacteristics.

Example embodiments provide a method of manufacturing a semiconductordevice having improved characteristics.

According to example embodiments, a semiconductor device includes anactive fin on a substrate, a gate structure on the active fin, a gatespacer structure on a sidewall of the gate structure, and a source/drainlayer on at least a portion of the active fin adjacent the gate spacerstructure. The gate spacer structure may include a wet etch stoppattern, an oxygen-containing silicon pattern, and an outgas singprevention pattern stacked, for example sequentially stacked.

According to example embodiments, a semiconductor device includes firstand second active fins on first and second regions, respectively, of asubstrate, first and second gate structures on the first and secondactive fins, respectively, a first gate spacer structure on a sidewallof the first gate structure, a second gate spacer structure on asidewall of the second gate structure, a first second source/drain layeron at least a portion of the first active fin adjacent the first gatespacer structure, and a second source/drain layer on at least a portionof the second active fin adjacent the second gate spacer structure. Thefirst gate spacer structure may include a first wet etch stop pattern, afirst oxygen-containing silicon pattern, and a first outgas singprevention pattern stacked, for example sequentially stacked, and thesecond gate spacer structure may include a second wet etch stop pattern,a second oxygen-containing silicon pattern, and a second outgassingprevention pattern stacked, for example sequentially stacked.

According to example embodiments, a method of manufacturing asemiconductor device where an isolation pattern may be formed on asubstrate to define an active fin thereon. A dummy gate structure may beformed on the active fin. A gate spacer structure including a wet etchstop pattern, an oxygen-containing silicon pattern, and an outgas singreduction or prevention pattern stacked, for example sequentiallystacked may be formed on a sidewall of the dummy gate structure. Anupper portion of the active fin may be removed using the dummy gatestructure and the gate spacer structure as an etching mask to form arecess thereon. A selective epitaxial growth (SEG) process may beperformed to form a source/drain layer in the recess. The dummy gatestructure may be replaced with a gate structure.

According to example embodiments, there is provided a method ofmanufacturing a semiconductor device. In the method, an isolationpattern may be formed on a substrate to define first and second activefins on first and second regions, respectively, of the substrate. Firstand second dummy gate structures may be formed on the first and secondactive fins, respectively. A first gate spacer structure including afirst wet etch stop pattern, a first oxygen-containing silicon pattern,and a first outgas sing reduction or prevention pattern stacked, forexample sequentially stacked may be formed on a sidewall of the firstdummy gate structure. A first selective epitaxial growth (SEG) processmay be performed to form a first source/drain layer on at least aportion of the first active fin adjacent the first gate spacerstructure. A second gate spacer structure including a second wet etchstop pattern, a second oxygen-containing silicon pattern, and a secondoutgassing reduction or prevention pattern stacked, for examplesequentially stacked may be formed on a sidewall of the second dummygate structure, the second dummy gate spacer structure. A secondselective epitaxial growth (SEG) process may be performed to form asecond source/drain layer on at least a portion of the second active finadjacent the second gate spacer structure. The first and second dummygate structures may be replaced with first and second gate structures,respectively.

In the method of manufacturing the semiconductor device, the gate spacerstructure on the sidewall of the dummy gate structure may include theoutgas sing reduction or prevention pattern, and thus, when thesource/drain layer is formed by the SEG process, e.g., carbon in theoxygen-containing silicon pattern may be prevented or impeded fromoutgas sing therefrom, so that no defect may be generated in thesource/drain layer. Additionally, the wet etch stop pattern may beformed under the oxygen-containing silicon pattern, and thus, when thewet etching process for replacing the dummy gate structure with the gatestructure is performed, the gate spacer structure may not be damaged butremain.

Example embodiments relate to a semiconductor structure that includes atleast one active fin on a substrate, a gate structure on the at leastone active fin, a gate spacer structure on a sidewall of the gatestructure, the gate spacer structure being configured to reduce outgassing of carbon, and a source/drain layer on at least a portion of the atleast one active fin adjacent the gate spacer structure.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings. FIGS. 1 to 71 represent non-limiting, example embodiments asdescribed herein.

FIGS. 1 to 38 are plan views and cross-sectional views illustratingstages of a method of manufacturing a semiconductor device in accordancewith example embodiments; and

FIGS. 39 to 71 are plan views and cross-sectional views illustratingstages of a method of manufacturing a semiconductor device in accordancewith example embodiments.

DETAILED DESCRIPTION

These and other features and advantages are described in, or areapparent from, the following detailed description of various exampleembodiments.

When the terms “about” or “substantially” are used in this specificationin connection with a numerical value, it is intended that the associatednumerical value include a tolerance of ±10% around the stated numericalvalue. Moreover, when reference is made to percentages in thisspecification, it is intended that those percentages are based onweight, i.e., weight percentages. The expression “up to” includesamounts of zero to the expressed upper limit and all valuestherebetween. When ranges are specified, the range includes all valuestherebetween such as increments of 0.1%. Moreover, when the words“generally” and “substantially” are used in connection with geometricshapes, it is intended that precision of the geometric shape is notrequired but that latitude for the shape is within the scope of thedisclosure. Although the tubular elements of the embodiments may becylindrical, other tubular cross-sectional forms are contemplated, suchas square, rectangular, oval, triangular and others.

In the drawing figures, the dimensions of layers and regions may beexaggerated for clarity of illustration. Like reference numerals referto like elements throughout. The same reference numbers indicate thesame components throughout the specification.

FIGS. 1 to 38 are plan views and cross-sectional views illustratingstages of a method of manufacturing a semiconductor device in accordancewith example embodiments.

Particularly, FIGS. 1, 4, 6, 9, 12, 15, 19, 22, 25, 28, 31 and 34 areplan views, and FIGS. 2-3, 5, 7-8, 10-11, 13-14, 16-18, 20-21, 23-24,26-27, 29-30, 32-33 and 35-38 are cross-sectional views.

FIGS. 2, 3, 5, 10, 13, 16, 18, 20, 23, 32 and 35 are cross-sectionalviews taken along lines A-A′ of corresponding plan views, respectively,FIGS. 7, 29 and 36 are cross-sectional views taken along lines B-B′ ofcorresponding plan views, respectively, and FIGS. 8, 11, 14, 17, 21, 24,26, 27, 30, 33, 37 and 38 are cross-sectional views taken along linesC-C′ of corresponding plan views, respectively.

Referring to FIGS. 1 and 2, an upper portion of a substrate 100 may beat least partially etched to form a first recess 110.

The substrate 100 may include a semiconductor material, e.g., silicon,germanium, silicon-germanium, etc., or III-V semiconductor compounds,e.g., GaP, GaAs, GaSb, etc. In some embodiments, the substrate 100 maybe a silicon-on-insulator (SOI) substrate, or a germanium-on-insulator(GOI) substrate.

As the first recess 110 is formed on the substrate 100, an active region105 may be defined on the substrate 100. The active region 105 mayprotrude from an upper surface of the substrate 100, and thus may bealso referred to as an active fin. A region of the substrate 100 onwhich the active fin 105 is not formed may be referred to as a fieldregion.

In example embodiments, the active fin 105 may extend in a firstdirection substantially parallel to the upper surface of the substrate100, and a plurality of active fins 105 may be formed in a seconddirection, which may be substantially parallel to the upper surface ofthe substrate 100 and cross the first direction. In example embodiments,the first and second directions may cross each other at a right angle,and thus may be substantially perpendicular to each other.

In example embodiments, the active fin 105 may have a constant widthfrom a top toward a bottom thereof, or a sidewall of the active fin 105may have a constant slope with respect to the upper surface of thesubstrate 100. FIG. 2 shows that the sidewall of the active fin 105 hasa constant slope with respect to the upper surface of the substrate 100.

However, referring to FIG. 3, the active fin 105 may have a widthgradually increasing from a top toward a bottom thereof, and an increaseratio of the width of the sidewall may also gradually increase from thetop toward the bottom thereof. Due to the characteristics of the etchingprocess, when the first recess 110 is formed to have a large aspectratio, the increase ratio of the width of the sidewall may graduallyincrease from the top toward the bottom thereof. Hereinafter, for theconvenience of explanation, only the active fin 105 shown in FIG. 2 willbe illustrated.

Referring to FIGS. 4 and 5, an isolation pattern 120 may be formed onthe substrate 100 to fill a lower portion of the recess 110.

In example embodiments, the isolation pattern 120 may be formed byforming an isolation layer on the substrate 100 to sufficiently fill therecess 110, planarizing the isolation layer until the upper surface ofthe substrate 100 may be exposed, and removing an upper portion of theisolation layer to expose an upper portion of the recess 110. Theisolation layer may be formed of or include an oxide, e.g., siliconoxide.

In example embodiments, the active fin 105 may include a lower activepattern 105 b whose sidewall may be covered by the isolation pattern120, and an upper active pattern 105 a not covered by the isolationpattern 120 but protruding therefrom. In example embodiments, the upperactive pattern 105 a may have a width in the second direction that maybe slightly less than a width of the lower active pattern 105 b.

In example embodiments, the isolation pattern 120 may be formed to havea multi-layered structure. Particularly, the isolation pattern 120 mayinclude first and second liners (not shown) stacked, for examplesequentially stacked on an inner wall of the recess 110, and a fillinginsulation layer (not shown) filling a remaining portion of the recess110 on the second liner. For example, the first liner may be formed ofor include an oxide, e.g., silicon oxide, the second liner may be formedof or include a nitride, e.g., silicon nitride, or polysilicon, and thefilling insulation layer may be formed of or include an oxide, e.g.,silicon oxide.

Referring to FIGS. 6 to 8, a dummy gate structure may be formed on thesubstrate 100.

The dummy gate structure may be formed by forming, for examplesequentially forming a dummy gate insulation layer, a dummy gateelectrode layer and a dummy gate mask layer on the substrate 100 and theisolation pattern 120, patterning the dummy gate mask layer to form adummy gate mask 150, and etching, for example sequentially etching thedummy gate electrode layer and the dummy gate insulation layer using thedummy gate mask 150 as an etching mask.

Thus, the dummy gate structure may include a dummy gate insulationpattern 130, a dummy gate electrode 140 and the dummy gate mask 150stacked, for example sequentially stacked on the substrate 100.

The dummy gate insulation layer may be formed of or include an oxide,e.g., silicon oxide, the dummy gate electrode layer may be formed of orinclude, e.g., polysilicon, and the dummy gate mask layer may be formedof or include a nitride, e.g., silicon nitride.

The dummy gate insulation layer may be formed by a chemical vapordeposition (CVD) process, an atomic layer deposition (ALD) process, etc.Alternatively, the dummy gate insulation layer may be formed by athermal oxidation process on an upper portion of the substrate 100, andin this case, the dummy gate insulation layer may be formed only on theupper active pattern 105 a. The dummy gate electrode layer and the dummygate mask layer may be formed by a CVD process, an ALD process, etc.

In example embodiments, the dummy gate structure may be formed to extendin the second direction, and a plurality of dummy gate structures may beformed in the first direction.

Referring to FIGS. 9 to 11, a spacer layer structure 210 may be formedon the active fin 105 and the isolation pattern 120 to cover the dummygate structure.

In example embodiments, the spacer layer structure 210 may include adiffusion reduction or prevention layer 160, a wet etch stop layer 170,an oxygen-containing silicon layer 180, an outgassing reduction orprevention layer 190 and an offset layer 200 stacked, for examplesequentially stacked.

The diffusion reduction or prevention layer 160 may reduce or preventcomponents of the wet etch stop layer 170 from diffusing into the activefin 105. For example, when the wet etch stop layer 170 includes siliconcarbonitride, carbon in the wet etch stop layer 170 may be prevented bythe diffusion reduction or prevention layer 160 from diffusing into theactive fin 105. The diffusion reduction or prevention layer 160 may beformed of or include, e.g., silicon nitride.

The wet etch stop layer 170 may not be removed by a wet etching processsubsequently performed. The wet etch stop layer 170 may be formed of orinclude, e.g., silicon carbonitride.

The oxygen-containing silicon layer 180 may be formed of or includeoxygen, thereby having a dielectric constant at least lower than siliconnitride. The oxygen-containing silicon layer 180 may be formed of orinclude, e.g., silicon oxycarbonitride, silicon dioxide and/or siliconoxynitride, etc.

The outgassing reduction or prevention layer 190 may reduce or preventcomponents of the oxygen-containing silicon layer 180, e.g., carbon fromoutgassing in subsequent processes. The outgassing reduction orprevention layer 190 may be formed of or include, e.g., silicon nitride.

The offset layer 200 may compensate a thickness of a preliminary gatespacer structure 212 (refer to FIGS. 12 to 14), which may be formed byanisotropically etching the spacer layer structure 210 subsequently, sothat the preliminary gate spacer structure 212 may have a desiredthickness. The offset layer 200 may be formed of or include, e.g.,silicon dioxide.

Referring to FIGS. 12 to 14, the spacer layer structure 210 may beanisotropically etched to form the preliminary gate spacer structure 212on each or at least one of opposite sidewalls of the dummy gatestructure in the first direction. A preliminary fin spacer structure 214may be formed on each or at least one of opposite sidewalls of the upperactive pattern 105 a in the second direction.

The preliminary gate spacer structure 212 may include a first diffusionreduction or prevention pattern 162, a first wet etch stop pattern 172,a first oxygen-containing silicon pattern 182, a first outgassingreduction or prevention pattern 192 and a first offset pattern 202stacked, for example sequentially stacked. The preliminary fin spacerstructure 214 may include a second diffusion reduction or preventionpattern 162, a second wet etch stop pattern 174, a secondoxygen-containing silicon pattern 184, a second outgassing reduction orprevention pattern 194 and a second offset pattern 204 stacked, forexample sequentially stacked.

Referring to FIGS. 15 to 17, an upper portion of the active fin 105adjacent the preliminary gate spacer structure 212 may be etched to forma second recess 230.

Particularly, the upper portion of the active fin 105 may be removedusing the dummy gate structure and the preliminary gate spacer structure212 on a sidewall thereof as an etching mask to form the second recess230. In example embodiments, when the second recess 230 is formed, thefirst offset pattern 202 including silicon dioxide, which may be easilyremoved in a dry etching process, may be removed, however, the firstoutgassing reduction or prevention pattern 192 including siliconnitride, which may not be easily removed in a dry etching process, maynot be removed but remain.

Thus, the preliminary gate spacer structure 212 may be transformed intoa gate spacer structure 222 including the first diffusion reduction orprevention pattern 162, the first wet etch stop pattern 172, the firstoxygen-containing silicon pattern 182 and the first outgas singreduction or prevention pattern 192 stacked, for example sequentiallystacked.

When the second recess 230 is formed, the preliminary fin spacerstructure 214 adjacent the active fin 105 may be mostly removed, andonly at least a portion of the preliminary fin spacer structure 214 mayremain and may be referred to as a fin spacer structure 224. Thepreliminary fin spacer structure 214 may have the second offset pattern204 including silicon dioxide that may be easily remove in a dry etchingprocess, and thus may be easily removed.

The fin spacer structure 224 may include the second diffusion reductionor prevention pattern 164, the second wet etch stop pattern 174, thesecond oxygen-containing silicon pattern 184 and the second outgassingreduction or prevention pattern 194 stacked, for example sequentiallystacked. In example embodiments, a height of a top surface of theremaining fin spacer structure 224 may be equal to or lower than aheight of the active fin 105 under the second recess 230.

FIGS. 15 to 17 show that only a portion of the upper active pattern 105a is etched to form the second recess 230, so that a bottom of thesecond recess 230 is higher than a top surface of the lower activepattern 105 b, however, the inventive concepts may not be limitedthereto.

For example, referring to FIG. 18, when the second recess 230 is formed,the upper active pattern 105 a may be removed so that the bottom of thesecond recess 230 may be substantially coplanar with the top surface ofthe lower active pattern 105 b. In this case, the preliminary fin spacerstructure 214 may be completely removed so that the fin spacer structure224 may not remain.

Alternatively, when the second recess 230 is formed, not only the upperactive pattern 105 a but also a portion of the lower active pattern 105b may be etched, and thus the bottom of the second recess 230 may belower than a top surface of the lower active pattern 105 b on which thesecond recess 230 is not formed.

In example embodiments, the etching process for forming the secondrecess 230 and the etching process for forming the preliminary gatespacer structure 212 and the preliminary fin spacer structure 214 may beperformed in-situ.

Referring to FIGS. 19 to 21, a source/drain layer 240 may be formed inthe second recess 230.

In example embodiments, the source/drain layer 240 may be formed by aselective epitaxial growth (SEG) process using an upper surface of theactive fin 105 exposed by the second recess 230 as a seed.

In example embodiments, the SEG process may be formed by providing asilicon source gas, a germanium source gas, an etching gas and a carriergas. The SEG process may be performed using e.g., silane (SiH₄) gas,disilane (Si₂H₆) gas, dichlorosilane (DCS) (SiH₂Cl₂) gas, etc., servingas the silicon source gas, e.g., germane (GeH₄) gas serving as thegermanium source gas, e.g., hydrogen chloride (HCl) gas serving as theetching gas, and e.g., hydrogen (H₂) gas serving as the carrier gas.Thus, a single crystalline silicon-germanium layer may be formed toserve as the source/drain layer 240. Additionally, a p-type impuritysource gas, e.g., diborane (B₂H₆) gas may be also used to form a singlecrystalline silicon-germanium layer doped with p-type impurities servingas the source/drain layer 240. Thus, the source/drain layer 240 mayserve as a source/drain region of a positive-channel metal oxidesemiconductor (PMOS) transistor.

During the SEG process, when the first oxygen-containing silicon pattern182 of the gate spacer structure 222 includes, e.g., siliconcarbonitride, carbon of the first oxygen-containing silicon pattern 182may be outgassed, and thus facet may be formed on the source/drain layer240 to generate defects therein. However, in example embodiments, thefirst outgassing reduction or prevention pattern 192 may be formed onthe first oxygen-containing silicon pattern 182 of the gate spacerstructure 222, and thus, when the SEG process is performed, carbon maybe prevented from outgassing from the first oxygen-containing siliconpattern 182.

The remaining fin spacer structure 224 may also have the secondoutgassing reduction or prevention pattern 194, and thus carbon may beprevented from outgassing from the second oxygen-containing siliconpattern 184.

The source/drain layer 240 may grow not only in a vertical direction butalso in a horizontal direction to fill the second recess 230, and maycontact a sidewall of the gate spacer structure 222. For example, whenthe substrate 100 is a (100) silicon substrate and the active fin 105has a <110> crystal direction, the source/drain layer 240 may have alowest growth rate along the <110> crystal direction, and thus thesource/drain layer 240 may have a {111} crystal plane.

In example embodiments, the source/drain layer 240 may have across-section taken along the second direction, and the cross-section ofthe source/drain layer 240 may have a shape similar to or the same as apentagon. In the shape, each or at least one of four sides except forone side contacting the upper surface of the active fin 105 may have anangle of about 54.7 degrees with respect to an upper surface of thesubstrate 100 or an upper surface of the isolation pattern 120.

In example embodiments, when the active fins 105 disposed in the seconddirection are close to each other, the source/drain layers 240 growingon the respective active fins 105 may be merged with each other. FIGS.19 to 21 show that two source/drain layers 240 grown on neighboring twoactive fins 105 are merged with each other, however, the inventiveconcepts may not be limited thereto. Thus, more than two source/drainlayers 240 may be merged with each other.

Up to now, the source/drain layer 240 serving as the source/drain regionof the PMOS transistor have been illustrated, however, the inventiveconcepts may not be limited thereto, and the source/drain layer 240 mayalso serve as a source/drain region of a negative-channel metal oxidesemiconductor (NMOS) transistor.

Particularly, the SEG process may be formed using a silicon source gas,a carbon source gas, an etching gas and a carrier gas, and thus a singlecrystalline silicon carbide layer may be formed as the source/drainlayer 240. In the SEG process, e.g., silane (SiH₄) gas, disilane (Si₂H₆)gas, dichlorosilane (SiH₂Cl₂) gas, etc., may be used as the siliconsource gas, e.g., monomethylsilane (SiH₃CH₃) gas may be used as thecarbon source gas, e.g., hydrogen chloride (HCl) gas may be sued as theetching gas, and e.g., hydrogen (H₂) gas may be used as the carrier gas.Additionally, an n-type impurity source gas, e.g., phosphine (PH₃) gasmay be also used to form a single crystalline silicon carbide layerdoped with n-type impurities.

Alternatively, the SEG process may be performed using a silicon sourcegas, an etching gas and a carrier gas, and thus a single crystallinesilicon layer may be formed as the source/drain layer 240. In the SEGprocess, an n-type impurity source gas, e.g., phosphine (PH₃) gas may bealso used to form a single crystalline silicon layer doped with n-typeimpurities.

Referring to FIGS. 22 to 24, an insulation layer 250 may be formed onthe active fin 105 and the isolation pattern 120 to cover the dummy gatestructure, the gate spacer structure 222, the fin spacer structure 224and the second source/drain layer 240 to a sufficient height, and may beplanarized until an upper surface of the dummy gate electrode 140 of thedummy gate structure may be exposed.

In the planarization process, the dummy gate mask 150 may be removed,and an upper portion of the gate spacer structure 222 may be at leastpartially removed.

A space between the merged source/drain layers 240 and the isolationpattern 120 may not be filled with the insulation layer 250, and thus anair gap 255 may be formed.

The insulation layer 250 may be formed of or include silicon oxide,e.g., tonen silazene (TOSZ). The planarization process may be performedby a chemical mechanical polishing (CMP) process and/or an etch backprocess.

Referring to FIGS. 25 to 27, the exposed dummy gate electrode 140 andthe dummy gate insulation pattern 130 thereunder may be removed to forman opening 260 exposing an inner sidewall of the gate spacer structure222 and an upper surface of the active fin 105.

In example embodiments, the dummy gate electrode 140 and the dummy gateinsulation pattern 130 may be removed by a dry etching process or a wetetching process.

The wet etching process may be performed using, e.g., hydrofluoric acid(HF), and the first diffusion reduction or prevention pattern 162 may beat least partially removed to expose the first wet etch stop pattern172. The first wet etch stop pattern 172 may not be easily removed bythe wet etching process, and thus at least a portion of the first wetetch stop pattern 172 may remain. Accordingly, a remaining portion ofthe gate spacer structure 222 may not be damaged.

A portion of the first diffusion reduction or prevention pattern 162 ona sidewall of the first wet etch stop pattern 172 may be mostly removed,however, at least a portion of the first diffusion reduction orprevention pattern 162 on the upper surface of the active fin 105 maynot completely removed but at least partially remain. Thus, thesource/drain layer 240 adjacent the first diffusion reduction orprevention pattern 162 may not be exposed by the opening 260.

FIG. 26 shows that the first diffusion reduction or prevention pattern162 is at least partially removed so that a sidewall of the remainingfirst diffusion reduction or prevention pattern 162 may be aligned withan extension plane of the sidewall of the first wet etch stop pattern172, and thus an upper surface of the first diffusion reduction orprevention pattern 162 may have an area substantially equal to a bottomof the first wet etch stop pattern 172.

However, the inventive concepts may not be limited thereto.

For example, referring to FIG. 27, the first diffusion reduction orprevention pattern 162 may be at least partially removed so that asidewall of the remaining first diffusion reduction or preventionpattern 162 may not be aligned with the extension plane of the sidewallof the first wet etch stop pattern 172, and an upper surface of thefirst diffusion reduction or prevention pattern 162 may have an arealess than the bottom of the first wet etch stop pattern 172.

Referring to FIGS. 28 to 30, a gate structure 310 may be formed to fillthe opening 260.

Particularly, after performing a thermal oxidation process on the uppersurface of the active fin 105 exposed by the opening 260 to form aninterface pattern 270, a gate insulation layer and a work functioncontrol layer may be formed, for example sequentially formed on theinterface pattern 270, the isolation pattern 120, the gate spacerstructure 222, and the insulation layer 250, and a gate electrode layermay be formed on the work function control layer to sufficiently fill aremaining portion of the opening 260.

The gate insulation layer may be formed of a metal oxide having a highdielectric constant, e.g., hafnium oxide, tantalum oxide, zirconiumoxide, or the like, by a CVD process or an ALD process. The workfunction control layer may be formed of a metal nitride or a metalalloy, e.g., titanium nitride, titanium aluminum, titanium aluminumnitride, tantalum nitride, tantalum aluminum nitride, etc., and the gateelectrode layer may be formed of a material having a low resistance,e.g., a metal such as aluminum, copper, tantalum, etc., or a metalnitride thereof. The work function control layer and the gate electrodelayer may be formed by an ALD process, a physical vapor deposition (PVD)process, or the like. In an example embodiment, a heat treatmentprocess, e.g., a rapid thermal annealing (RTA) process, a spike rapidthermal annealing (spike RTA) process, a flash rapid thermal annealing(flash RTA) process or a laser annealing process may be furtherperformed.

The interface pattern 270 may be formed instead of the thermal oxidationprocess, by a CVD process, an ALD process, or the like, similarly to thegate insulation layer or the gate electrode layer. In this case, theinterface pattern 270 may be formed not only on the upper surface of theactive fin 105 but also on the upper surface of the isolation pattern120 and the inner sidewall of the gate spacer structure 222.

The gate electrode layer, the work function control layer, and the gateinsulation layer may be planarized until an upper surface of theinsulation layer 250 may be exposed to form a gate insulation pattern280 and a work function control pattern 290 stacked, for examplesequentially stacked on the interface pattern 270, the isolation pattern120, and the inner sidewall of the gate spacer structure 222, and a gateelectrode 300 filling the remaining portion of the opening 260 on thework function control pattern 290.

Accordingly, a bottom and a sidewall of the gate electrode 300 may becovered by the work function control pattern 290. In exampleembodiments, the planarization process may be performed by a CMP processand/or an etch back process.

The interface pattern 270, the gate insulation pattern 280, the workfunction control pattern 290 and the gate electrode 300 stacked, forexample sequentially stacked may form the gate structure 310, and thegate structure 310 together with the source/drain layer 240 may form aPMOS transistor or an NMOS transistor according to the conductivity typeof the source/drain layer 240.

Referring to FIGS. 31 to 33, a capping layer 320 and an insulatinginterlayer 330 may be formed, for example sequentially formed on theinsulation layer 250, the gate structure 310, and the gate spacerstructure 222, and a contact hole 340 may be formed through theinsulation layer 250, the capping layer 320 and the insulatinginterlayer 330 to expose an upper surface of the source/drain layer 240.

The capping layer 320 may be formed of a nitride, e.g., silicon nitride,silicon oxynitride, silicon carbonitride, silicon oxycarbonitride, etc.,and the insulating interlayer 330 may be formed of silicon oxide, e.g.,tetra ethyl ortho silicate (TEOS).

In example embodiments, the contact hole 340 may be formed to beself-aligned with the gate spacer structure 222, and thus may expose anentire portion of the upper surface of the source/drain layer 240 in thefirst direction. However, the inventive concepts may not be limitedthereto, and the contact hole 340 may not be self-aligned with the gatespacer structure 222, but may expose only a portion of the upper surfaceof the source/drain layer 240 in the first direction.

Referring to FIGS. 34 to 37, after forming a first metal layer on theexposed upper surface of the source/drain layer 240, a sidewall of thecontact hole 340, and the upper surface of the insulating interlayer330, a heat treatment process may be performed thereon to form a metalsilicide pattern 350 on the source/drain layer 240. An unreacted portionof the first metal layer may be removed.

The first metal layer may be formed of a metal, e.g., titanium, cobalt,nickel, etc.

A barrier layer may be formed on the metal silicide pattern 350, thesidewall of the contact hole 340 and the upper surface of the insulatinginterlayer 330, a second metal layer may be formed on the barrier layerto fill the contact hole 340, and the second metal layer and the barrierlayer may be planarized until the upper surface of the insulatinginterlayer 330 may be exposed.

Thus, a contact plug 380 may be formed on the metal silicide pattern 350to fill the contact hole 340.

The barrier layer may be formed of a metal nitride, e.g., titaniumnitride, tantalum nitride, tungsten nitride, etc., and the second metallayer may be formed of a metal, e.g., tungsten, copper, etc.

The contact plug 380 may include a metal pattern 370 and a barrierpattern 360 covering a bottom and a sidewall thereof.

A wiring (not shown) and a via (not shown) may be further formed to beelectrically connected to the contact plug 380 to complete thesemiconductor device.

FIG. 38 shows that the semiconductor device includes the first diffusionreduction or prevention pattern 162 of which an upper surface may havean area less than the bottom of the first wet etch stop pattern 172, asshown in FIG. 27.

As illustrated above, the gate spacer structure 222 may include thefirst outgassing reduction or prevention pattern 192 on the sidewall ofthe dummy gate structure, and thus, when the source/drain layer 240 isformed by the SEG process, e.g., carbon in the first oxygen-containingsilicon pattern 182 may be prevented from outgassing therefrom, so thatno defect may be generated in the source/drain layer 240. Additionally,the first wet etch stop pattern 172 may be formed under the firstoxygen-containing silicon pattern 182, and thus, when the wet etchingprocess for replacing the dummy gate structure with the gate structure310 is performed, the gate spacer structure 222 may not be damaged butremain.

When the first wet etch stop pattern 172 includes, e.g., siliconcarbonitride, carbon in the first wet etch stop pattern 172 may beprevented by the first diffusion reduction or prevention pattern 162under the first wet etch stop pattern 172 from diffusing into the activefin 105. Additionally, even if the first diffusion reduction orprevention pattern 162 is easily removed in the wet etching process sothat at least a portion of the first diffusion reduction or preventionpattern 162 on the sidewall of the first wet etch stop pattern 172 iscompletely removed, at least a portion of the first diffusion reductionor prevention pattern 162 on the active fin 105 may not be completelyremoved, and thus the opening 260 formed in the wet etching process maynot expose the source/drain layer 240.

Each or at least one of the first wet etch stop pattern 172 and thefirst oxygen-containing silicon pattern 182 of the gate spacer structure222 may have a cross-section taken along the first direction, which mayhave an L-like shape, and a sidewall and a bottom of the firstoutgassing reduction or prevention pattern 192 may be covered by thefirst oxygen-containing silicon pattern 182.

FIGS. 39 to 71 are plan views and cross-sectional views illustratingstages of a method of manufacturing a semiconductor device in accordancewith example embodiments. Particularly, FIGS. 39, 41, 44, 48, 51, 55,59, 63 and 67 are plan views, and FIGS. 40, 42-43, 45-47, 49-50, 52-54,56-58, 60-62, 64-66 and 68-71 are cross-sectional views.

FIGS. 40, 45, 49, 52, 56, 60 and 68 are cross-sectional views takenalong lines D-D′ of corresponding plan views, respectively, FIGS. 42, 64and 69 are cross-sectional views taken along lines E-E′ of correspondingplan views, respectively, FIGS. 43, 46, 50, 53, 57, 61, 65 and 70 arecross-sectional views taken along lines F-F′ of corresponding planviews, respectively, and FIGS. 47, 54, 58, 62, 66 and 71 arecross-sectional views taken along lines G-G′ of corresponding planviews.

This method is an application to a complementary metal oxidesemiconductor (CMOS) transistor of the method illustrated with referenceto FIGS. 1 to 38. Thus, the method may include processes substantiallythe same as or similar to those illustrated with reference to FIGS. 1 to38, and detailed descriptions thereon are omitted herein.

Referring to FIGS. 39 and 40, processes substantially the same as orsimilar to those illustrated with reference to FIGS. 1 to 5 may beperformed.

Thus, upper portions of a substrate 400 may be at least partially etchedto form first and second recesses 412 and 414.

The substrate 400 may include first and second regions I and II. Inexample embodiments, the first region I may serve as a PMOS region, andthe second region II may serve as an NMOS region.

As the first and second recesses 412 and 414 are formed on the substrate400, first and second active regions 402 and 404 may be defined on thefirst and second regions I and II, respectively, of the substrate 400.The first and second active regions 402 and 404 may be also referred toas first and second active fins, respectively. A region of the substrate400 on which no active fin is formed may be referred to as a fieldregion.

In example embodiments, each or at least one of the first and secondactive regions 402 and 404 may extend in a first direction substantiallyparallel to an upper surface of the substrate 400, and a plurality offirst active fins 402 and a plurality of second active fins 404 may beformed in a second direction, which may be substantially parallel to theupper surface of the substrate 400 and cross the first direction. Inexample embodiments, the first and second directions may cross eachother at a right angle, and thus may be substantially perpendicular toeach other.

An isolation pattern 420 may be formed on the substrate 400 to filllower portions of the first and second recesses 412 and 414.

The first active fin 402 may include a first lower active pattern 402 bwhose sidewall may be covered by the isolation pattern 420, and a firstupper active pattern 402 a not covered by the isolation pattern 420 butprotruding therefrom. The second active fin 404 may include a secondlower active pattern 404 b whose sidewall may be covered by theisolation pattern 420, and a second upper active pattern 404 a notcovered by the isolation pattern 420 but protruding therefrom.

Referring to FIGS. 41 to 43, processes substantially the same as orsimilar to those illustrated with reference to FIGS. 6 to 8 may beperformed to form first and second dummy gate structures on the firstand second regions I and II, respectively, of the substrate 400.

The first dummy gate structure may include a first dummy gate insulationpattern 432, a first dummy gate electrode 442 and the first dummy gatemask 452 stacked, for example sequentially stacked on the first region Iof the substrate 400, and the second dummy gate structure may include asecond dummy gate insulation pattern 434, a second dummy gate electrode444 and the second dummy gate mask 454 stacked, for example sequentiallystacked on the second region II of the substrate 400.

Referring to FIGS. 44 to 47, processes substantially the same as orsimilar to those illustrated with reference to FIGS. 9 to 11 may beperformed to form a preliminary spacer layer structure 510 on the firstand second active fins 402 and 404 and the isolation pattern 420 tocover the first and second dummy gate structures.

In example embodiments, the preliminary spacer layer structure 510 mayinclude a diffusion reduction or prevention layer 460, a wet etch stoplayer 470, an oxygen-containing silicon layer 480, an outgassingreduction or prevention layer 490 and a first offset layer 500 stacked,for example sequentially stacked.

The diffusion reduction or prevention layer 460 may be formed of, e.g.,silicon nitride, the wet etch stop layer 470 may be formed of, e.g.,silicon carbonitride, the oxygen-containing silicon layer 480 may beformed of e.g., silicon oxycarbonitride, silicon dioxide and/or siliconoxynitride, etc., the outgassing reduction or prevention layer 490 maybe formed of, e.g., silicon nitride, and the offset layer 500 may beformed of, e.g., silicon dioxide.

A first photoresist pattern 10 may be formed to cover the second regionII of the substrate 400, and processes substantially the same as orsimilar to those illustrated with reference to FIGS. 12 to 14 may beperformed to anisotropically etch the preliminary spacer layer structure510.

Thus, a first preliminary gate spacer structure 512 may be formed oneach or at least one of opposite sidewalls of the first dummy gatestructure in the first direction on the first region I of the substrate400, and a first preliminary fin spacer structure 514 may be formed oneach or at least one of opposite sidewalls of the first upper activepattern 402 a in the second direction on the first region I of thesubstrate 400.

The first preliminary gate spacer structure 512 may include a firstdiffusion reduction or prevention pattern 462, a first wet etch stoppattern 472, a first oxygen-containing silicon pattern 482, a firstoutgassing reduction or prevention pattern 492 and a first offsetpattern 502 stacked, for example sequentially stacked, and the firstpreliminary fin spacer structure 514 may include a second diffusionreduction or prevention pattern 464, a second wet etch stop pattern 474,a second oxygen-containing silicon pattern 484, a second outgassingreduction or prevention pattern 494 and a second offset pattern 504stacked, for example sequentially stacked.

A portion of the preliminary spacer layer structure 510 on the secondregion II of the substrate 400 may remain.

Referring to FIGS. 48 to 50, after removing the first photoresistpattern 10, processes substantially the same as or similar to thoseillustrated with reference to FIGS. 15 to 21 may be performed.

An upper portion of the first active fin 402 adjacent the firstpreliminary gate spacer structure 512 may be etched to form a thirdrecess (not shown). That is, the upper portion of the active fin 402 maybe removed using the first dummy gate structure and the firstpreliminary gate spacer structure 512 on a sidewall thereof as anetching mask to form the third recess. The first offset pattern 502including silicon dioxide, which may be easily removed in a dry etchingprocess, may be removed, however, the first outgassing reduction orprevention pattern 492 including silicon nitride, which may not beeasily removed in a dry etching process, may not be removed but remain.Thus, the first preliminary gate spacer structure 512 may be transformedinto a first gate spacer structure 522 including the first diffusionreduction or prevention pattern 462, the first wet etch stop pattern472, the first oxygen-containing silicon pattern 482 and the firstoutgassing reduction or prevention pattern 492 stacked, for examplesequentially stacked.

When the third recess is formed, the first preliminary fin spacerstructure 514 adjacent the first active fin 402 may be mostly removed,and only a portion of the first preliminary fin spacer structure 514 mayremain and may be referred to as a first fin spacer structure 524. Thefirst fin spacer structure 524 may include the second diffusionreduction or prevention pattern 464, the second wet etch stop pattern474, the second oxygen-containing silicon pattern 484 and the secondoutgassing reduction or prevention pattern 494 stacked, for examplesequentially stacked. In example embodiments, a height of a top surfaceof the remaining first fin spacer structure 524 may be equal to or lowerthan a height of the first active fin 402 under the third recess.

During the dry etching process for forming the third recess, the firstoffset layer 500 including silicon dioxide may be removed, and thus thespacer layer structure 520 including the diffusion reduction orprevention layer 460, the wet etch stop layer 470, the oxygen-containingsilicon layer 480 and the outgassing reduction or prevention layer 490may remain on the second region II of the substrate 400.

A first source/drain layer 542 may be formed by a selective epitaxialgrowth (SEG) process using an upper surface of the first active fin 402exposed by the third recess as a seed.

In example embodiments, the SEG process may be formed by providing asilicon source gas, a germanium source gas, an etching gas and a carriergas, and thus a single crystalline silicon-germanium layer doped withp-type impurities may be formed to serve as the first source/drain layer542. The first source/drain layer 542 may serve as a source/drain regionof a PMOS transistor.

During the SEG process, the first outgassing reduction or preventionpattern 492 may be formed on the first oxygen-containing silicon pattern482 of the first gate spacer structure 522, and thus, even if the firstoxygen-containing silicon pattern 482 includes, e.g., siliconoxycarbonitride, carbon may be prevented from outgassing from the firstoxygen-containing silicon pattern 482. Additionally, the secondoutgassing reduction or prevention pattern 494 may cover the secondoxygen-containing silicon pattern 484 of the remaining first fin spacerstructure 524, and thus carbon may be prevented from outgassing from thesecond oxygen-containing silicon pattern 484.

The spacer layer structure 520 may be formed on the second active fin404 on the second region II of the substrate 400, and thus nosource/drain layer may be formed by the SEG process.

Referring to FIGS. 51 to 54, processes substantially the same as orsimilar to those illustrated with reference to FIGS. 44 to 47 may beperformed.

First, a growth reduction or prevention layer structure 570 may beformed on the first source/drain layer 542, the isolation pattern 420,the first dummy gate structure, the first gate spacer structure 522 andthe first fin spacer structure 524 on the first region I of thesubstrate 400, and on the spacer layer structure 520 on the secondregion II of the substrate 400.

In example embodiments, the growth reduction or prevention layerstructure 570 may include a growth reduction or prevention layer 550 anda second offset layer 560 stacked, for example sequentially stacked.

The growth reduction or prevention layer 550 may be formed of, e.g.,silicon nitride, and the second offset layer 560 may be formed of, e.g.,silicon dioxide.

A second photoresist pattern 20 may be formed to cover the first regionI of the substrate 400, and processes substantially the same as orsimilar to those illustrated with reference to FIGS. 12 to 14 may beperformed to anisotropically etch the spacer layer structure 520 and thegrowth reduction or prevention layer structure 570 stacked, for examplesequentially stacked on the second region II of the substrate 400.

Thus, a second gate spacer structure 526 and a first growth reduction orprevention pattern structure 576 may be stacked, for examplesequentially stacked on each or at least one of opposite sidewalls ofthe second dummy gate structure in the first direction on the secondregion II of the substrate 400, and a second fin spacer structure 528and a second growth reduction or prevention pattern structure 578 may bestacked, for example sequentially stacked on each or at least one ofopposite sidewalls of the second upper active pattern 404 a in thesecond direction on the second region II of the substrate 400.

The second gate spacer structure 526 may include a third diffusionreduction or prevention pattern 466, a third wet etch stop pattern 476,a third oxygen-containing silicon pattern 486 and a third outgassingreduction or prevention pattern 496 stacked, for example sequentiallystacked, and the second fin spacer structure 528 may include a fourthdiffusion reduction or prevention pattern 468, a fourth wet etch stoppattern 478, a fourth oxygen-containing silicon pattern 488 and a fourthoutgassing reduction or prevention pattern 498 stacked, for examplesequentially stacked. Additionally, the first growth reduction orprevention pattern structure 576 may include a first growth reduction orprevention pattern 556 and a third offset pattern 566 stacked, forexample sequentially stacked, and the second growth reduction orprevention pattern 578 may include a second growth reduction orprevention pattern 558 and a fourth offset pattern 568 stacked, forexample sequentially stacked.

A portion of the growth reduction or prevention layer structure 570 onthe first region I of the substrate 400 may remain.

Referring to FIGS. 55 to 58, processes substantially the same as orsimilar to those illustrated with reference to FIGS. 48 to 50 may beperformed.

First, after removing the second photoresist pattern 20, an upperportion of the second active fin 404 may be etched using the seconddummy gate structure, and the second gate spacer structure 526 and thefirst growth reduction or prevention pattern structure 576 on a sidewallof the second dummy gate structure as an etching mask to form a fourthrecess (not shown). The third offset pattern 566 including silicondioxide, which may be easily removed in a dry etching process, may beremoved, however, the first growth reduction or prevention pattern 556including silicon nitride, which may not be easily removed in a dryetching process, may not be removed but remain. Thus, a third gatespacer structure 586 including the second gate spacer structure 526 andthe first growth reduction or prevention pattern 556 stacked, forexample sequentially stacked may be formed on the sidewall of the seconddummy gate structure.

When the fourth recess is formed, the second fin spacer structure 528and the second growth reduction or prevention pattern 578 adjacent thesecond active fin 404 may be mostly removed, and only a portion of thesecond fin spacer structure 528 may remain. In example embodiments, aheight of a top surface of the remaining second fin spacer structure 528may be equal to or lower than a height of the second active fin 404under the fourth recess.

During the dry etching process for forming the fourth recess, the secondoffset layer 560 including silicon dioxide may be removed, and thegrowth reduction or prevention layer 550 may remain on the first regionI of the substrate 400.

A second source/drain layer 544 may be formed by an SEG process using anupper surface of the second active fin 404 exposed by the fourth recessas a seed.

In example embodiments, the SEG process may be formed by providing asilicon source gas, a carbon source gas, an n-type impurity source gas,an etching gas and a carrier gas, and thus a single crystalline siliconcarbide layer doped with n-type impurities may be formed to serve as thesecond source/drain layer 544. Alternatively, the SEG process may beformed by providing a silicon source gas, an n-type impurity source gas,an etching gas and a carrier gas, and thus a single crystalline siliconlayer doped with n-type impurities may be formed to serve as the secondsource/drain layer 544. The second source/drain layer 544 may serve as asource/drain region of an NMOS transistor.

During the SEG process, the third outgassing reduction or preventionpattern 496 may be formed on the third oxygen-containing silicon pattern486 of the second gate spacer structure 526, and thus, even if the thirdoxygen-containing silicon pattern 486 includes, e.g., siliconoxycarbonitride, carbon may be prevented from outgassing from the thirdoxygen-containing silicon pattern 486. Additionally, the fourthoutgassing reduction or prevention pattern 498 may cover the fourthoxygen-containing silicon pattern 488 of the remaining second fin spacerstructure 528, and thus carbon may be prevented from outgassing from thefourth oxygen-containing silicon pattern 488.

The growth reduction or prevention layer 550 may be formed on the firstactive fin 402 in the first region I of the substrate 400, and thus nosource/drain layer may be formed by the SEG process.

Referring to FIGS. 59 to 62, processes substantially the same as orsimilar to those illustrated with reference to FIGS. 22 to 27 may beperformed.

First, an insulation layer 620 may be formed on the substrate 400 andthe isolation pattern 420 to cover the second dummy gate structure, thesecond gate spacer structure 526, the second fin spacer layer structure528, and the second source/drain layer 544 to a sufficient height, andmay be planarized until upper surfaces of the first and second dummygate electrodes 442 and 444 of the respective first and second dummygate structures may be exposed.

In the planarization process, the first and second dummy gate masks 452and 454 may be removed.

A space between the merged first source/drain layers 542 and theisolation pattern 420 and a space between the merged second source/drainlayers 544 and the isolation pattern 420 may not be filled with theinsulation layer 620, and thus first and second air gaps 622 and 624 maybe formed, respectively.

The exposed first and second dummy gate electrodes 442 and 444 and thefirst and second dummy gate insulation patterns 432 and 434 thereundermay be removed to form a first opening 632 exposing an inner sidewall ofthe first gate spacer structure 522 and an upper surface of the firstactive fin 402, and to form a second opening 634 exposing an innersidewall of the second gate spacer structure 524 and an upper surface ofthe second active fin 404.

The first and second dummy gate electrodes 442 and 444 and the first andsecond dummy gate insulation patterns 432 and 434 thereunder may beremoved by a dry etching process and a wet etching process, and thefirst and third diffusion reduction or prevention patterns 462 and 464may be at least partially removed to expose the first and third wet etchstop patterns 472 and 476, respectively. However, the first and thirdwet etch stop patterns 472 and 476 may not be easily remove in the wetetching process, and thus may remain. Accordingly, the first and secondgate spacer structures 522 and 524 may not be damaged.

Portions of the first and third diffusion reduction or preventionpatterns 462 and 466 on sidewalls of the respective first and third wetetch stop patterns 472 and 476 may be mostly removed. However, portionsof the first and third diffusion reduction or prevention patterns 462and 466 on upper surfaces of the respective first and second active fins402 and 404 may not be completely removed but at least partially remain.Accordingly, the first and second source/drain layers 542 and 544adjacent the respective first and second active fins 402 and 404 may notbe exposed by the respective first and second openings 632 and 634.

Referring to FIGS. 63 to 66, processes substantially the same as orsimilar to those illustrated with reference to FIGS. 28 to 30 may beperformed to form first and second gate structures 682 and 684 in thefirst and second openings 632 and 634, respectively.

The first gate structure 682 may include a first interface pattern 642,a first gate insulation pattern 652, a first work function controlpattern 662 and a first gate electrode 672 stacked, for examplesequentially stacked, and the first gate structure 682 together with thefirst source/drain layer structure 542 may form a PMOS transistor. Thesecond gate structure 684 may include a second interface pattern 644, asecond gate insulation pattern 654, a second work function controlpattern 664 and a second gate electrode 674 stacked, for examplesequentially stacked, and the second gate structure 684 together withthe second source/drain layer structure 544 may form an NMOS transistor.

Up to now, after the PMOS transistor is formed on the first region I ofthe substrate 400, the NMOS transistor is formed on the second region IIof the substrate 400, however, the inventive concepts may not be limitedthereto. That is, after the NMOS transistor is formed on the firstregion I of the substrate 400, and the PMOS transistor may be formed onthe second region II of the substrate 400.

The first gate spacer structure 522 including the first diffusionreduction or prevention pattern 462, the first wet etch stop pattern472, the first oxygen-containing silicon pattern 482 and the firstoutgassing reduction or prevention pattern 492 stacked, for examplesequentially stacked may be formed on each or at least one of oppositesidewalls of the first gate structure 682 in the first direction, andthe growth reduction or prevention layer 550 may be formed on thesidewall of the first gate spacer structure 522 and the firstsource/drain layer 542. In example embodiments, at least a portion ofthe growth reduction or prevention layer 550 adjacent the first gatestructure 682 may have a cross-section taken along the first directionof which a shape may be similar to or the same as an “L.”

The third gate spacer structure 586 having the second gate spacerstructure 526 including the third diffusion reduction or preventionpattern 466, the third wet etch stop pattern 476, the thirdoxygen-containing silicon pattern 486 and the third outgassing reductionor prevention pattern 496 stacked, for example sequentially stacked oneach or at least one of opposite sidewalls of the second gate structure684 in the first direction, and the first growth reduction or preventionpattern 556 on the second gate spacer structure 526 may be formed. Inexample embodiments, the second spacer structure 526 may have across-section taken along the first direction of which a shape may besimilar to or the same as an “L,” and an inner sidewall and a bottom ofthe first growth reduction or prevention pattern 556 may be covered bythe second gate spacer structure 526.

Referring to FIGS. 67 to 71, processes substantially the same as orsimilar to or the same as those illustrated with reference to FIGS. 31to 38 may be performed to complete the semiconductor device.

Thus, a capping layer 690 and an insulating interlayer 700 may beformed, for example sequentially formed on the insulation layer 620, thefirst and second gate structures 682 and 684, the growth reduction orprevention layer 550, and the first and third gate spacer structures 522and 586, and first and second contact holes (not shown) may be formedthrough the insulation layer 620, the capping layer 690 and theinsulating interlayer 700 to expose upper surfaces of the first andsecond source/drain layer structures 542 and 544, respectively.

The first and second contact holes may be or may not be self-alignedwith the first and third gate spacer structures 522 and 586,respectively.

After forming a first metal layer on the exposed upper surfaces of thefirst and second source/drain layer structures 542 and 544, sidewalls ofthe first and second contact holes, and the upper surface of theinsulating interlayer 700, a heat treatment process may be performedthereon to form first and second metal silicide patterns 712 and 714 onthe first and second source/drain layer structures 542 and 544,respectively. An unreacted portion of the first metal layer may beremoved.

A barrier layer may be formed on upper surfaces of the first and secondmetal silicide patterns 712 and 714, the sidewalls of the first andsecond contact holes, and the upper surface of the insulating interlayer700, a second metal layer may be formed on the barrier layer to fill thefirst and second contact holes, and the second metal layer and thebarrier layer may be planarized until the upper surface of theinsulating interlayer 700 may be exposed. Thus, first and second contactplugs 742 and 744 may be formed on the first and second metal silicidepatterns 712 and 714, respectively.

The first contact plug 742 may include a first metal pattern 732 and afirst barrier pattern 722 covering a bottom and a sidewall thereof, andthe second contact plug 744 may include a second metal pattern 734 and asecond barrier pattern 724 covering a bottom and a sidewall thereof.

A wiring (not shown) and a via (not shown) may be further formed to beelectrically connected to the first and second contact plugs 742 and744.

The above method of manufacturing the semiconductor device may beapplied to methods of manufacturing various types of memory devicesincluding spacers on sidewalls of gate structures. For example, themethod may be applied to methods of manufacturing logic devices such ascentral processing units (CPUs), main processing units (MPUs), orapplication processors (APs), or the like. Additionally, the method maybe applied to methods of manufacturing volatile memory devices such asDRAM devices or SRAM devices, or non-volatile memory devices such asflash memory devices, PRAM devices, MRAM devices, RRAM devices, or thelike.

The foregoing is illustrative of example embodiments and is not to beconstrued as limiting thereof. Although a few example embodiments havebeen described, those skilled in the art will readily appreciate thatmany modifications are possible in the example embodiments withoutmaterially departing from the novel teachings and advantages of theinventive concepts. Accordingly, all such modifications are intended tobe included within the scope of the inventive concepts as defined in theclaims. In the claims, means-plus-function clauses are intended to coverthe structures described herein as performing the recited function andnot only structural equivalents but also equivalent structures.Therefore, it is to be understood that the foregoing is illustrative ofvarious example embodiments and is not to be construed as limited to thespecific example embodiments disclosed, and that modifications to thedisclosed example embodiments, as well as other example embodiments, areintended to be included within the scope of the appended claims.

What is claimed is:
 1. A method of manufacturing a semiconductor device,the method comprising: forming an isolation pattern on a substrate todefine an active fin thereon; forming a dummy gate structure on theactive fin; forming a gate spacer structure on a sidewall of the dummygate structure, the dummy gate spacer structure including a wet etchstop pattern, an oxygen-containing silicon pattern, and an outgassingprevention pattern, the wet etch stop pattern being in contact with thesidewall of the dummy gate structure and a portion of the active fin,the oxygen-containing silicon pattern being between the wet etch stoppattern and the outgassing prevention pattern such that the wet etchstop pattern and outgassing prevention pattern do not contact, each ofthe wet etch stop pattern and the oxygen-containing silicon patternhaving a cross-section taken along a direction, the cross-section havingan L-like shape, and neither the oxygen-containing silicon pattern northe outgassing prevention pattern contacting the active fin, forming thegate spacer structure on the sidewall of the dummy gate structureincludes forming a spacer layer structure on the substrate to cover thedummy gate structure, the spacer layer structure including a wet etchstop layer, an oxygen-containing silicon layer and an outgassingprevention layer sequentially stacked; and anisotropically etching thespacer layer structure to form the gate spacer structure, wherein a finspacer structure is formed on a sidewall of the active fin when thespacer layer structure is anisotropically etched; removing an upperportion of the active fin using the dummy gate structure and the gatespacer structure as an etching mask to form a recess thereon, whereinthe fin spacer structure on the sidewall of the active fin is removedwhen the upper portion of the active fin is removed to form the recess;performing a selective epitaxial growth (SEG) process to form asource/drain layer in the recess; and replacing the dummy gate structurewith a gate structure.
 2. The method of claim 1, wherein the spacerlayer structure further includes a diffusion prevention layer under thewet etch stop layer, and wherein the diffusion prevention layer istransformed into a diffusion prevention pattern when the spacer layerstructure is anisotropically etched.
 3. The method of claim 2, whereinthe wet etch stop layer includes silicon carbonitride, and wherein thediffusion prevention layer prevents a component of the wet etch stoplayer from diffusing into the active fin.
 4. The method of claim 2,wherein the diffusion prevention layer includes silicon nitride.
 5. Themethod of claim 2, wherein replacing the dummy gate structure with thegate structure includes: removing the dummy gate structure by an etchingprocess to form an opening exposing an upper surface of the active fin,the etching process including a wet etching process; and forming thegate structure in the opening.
 6. The method of claim 5, wherein thediffusion prevention pattern is at least partially removed by the wetetching process to expose the wet etch stop pattern, and wherein the wetetch stop pattern is not completely removed by the wet etching process,but at least a portion of the wet etch stop pattern remains.
 7. Themethod of claim 6, wherein at least a portion of the diffusionprevention pattern on the upper surface of the active fin at leastpartially remains after the etching process.
 8. The method of claim 1,wherein the spacer layer structure includes an offset layer on theoutgassing prevention layer, the offset layer including silicon oxide,and wherein the offset layer is removed when the spacer layer structureis anisotropically etched.
 9. The method of claim 1, wherein theoxygen-containing silicon pattern includes silicon oxycarbonitride,silicon dioxide and/or silicon oxynitride.
 10. The method of claim 9,wherein the oxygen-containing silicon pattern includes siliconoxycarbonitride, and wherein the outgassing prevention pattern preventscarbon in the oxygen-containing silicon pattern from outgassing when thesource/drain layer is formed in the recess.
 11. A method ofmanufacturing a semiconductor device, the method comprising: forming anisolation pattern on a substrate to define an active fin thereon;forming a dummy gate structure on the active fin; forming a gate spacerstructure on a sidewall of the dummy gate structure, the dummy gatespacer structure including a wet etch stop pattern, an oxygen-containingsilicon pattern, and an outgassing prevention pattern sequentiallystacked conformally along the sidewall of the dummy gate structure andalong a portion of the active fin; removing an upper portion of theactive fin using the dummy gate structure and the gate spacer structureas an etching mask to form a recess thereon; performing a selectiveepitaxial growth (SEG) process to form a source/drain layer in therecess; and replacing the dummy gate structure with a gate structure;wherein forming the gate spacer structure on the sidewall of the dummygate structure includes forming a spacer layer structure on thesubstrate to cover the dummy gate structure, the spacer layer structureincluding a wet etch stop layer, an oxygen-containing silicon layer andan outgassing prevention layer sequentially stacked, and anisotropicallyetching the spacer layer structure to form the gate spacer structure,wherein the spacer layer structure includes a diffusion prevention layerunder the wet etch stop layer, and wherein the diffusion preventionlayer is transformed into a diffusion prevention pattern when the spacerlayer structure is anisotropically etched.
 12. A method of manufacturinga semiconductor device, the method comprising: forming an isolationpattern on a substrate to define an active fin thereon; forming a dummygate structure on the active fin; forming a gate spacer structure on asidewall of the dummy gate structure, the dummy gate spacer structureincluding a wet etch stop pattern, an oxygen-containing silicon pattern,and an outgassing prevention pattern, the wet etch stop pattern being incontact with the sidewall of the dummy gate structure and a portion ofthe active fin, the oxygen-containing silicon pattern being between thewet etch stop pattern and the outgassing prevention pattern such thatthe wet etch stop pattern and outgassing prevention pattern do notcontact, each of the wet etch stop pattern and the oxygen-containingsilicon pattern having a cross-section taken along a direction, thecross-section having an L-like shape, and neither the oxygen-containingsilicon pattern nor the outgassing prevention pattern contacting theactive fin, forming the gate spacer structure on the sidewall of thedummy gate structure includes forming a spacer layer structure on thesubstrate to cover the dummy gate structure, the spacer layer structureincluding a wet etch stop layer, an oxygen-containing silicon layer andan outgassing prevention layer sequentially stacked; and anisotropicallyetching the spacer layer structure to form the gate spacer structurewherein the spacer layer structure includes an offset layer on theoutgassing prevention layer, the offset layer including silicon oxide,and wherein the offset layer is removed when the spacer layer structureis anisotropically etched; removing an upper portion of the active finusing the dummy gate structure and the gate spacer structure as anetching mask to form a recess thereon; performing a selective epitaxialgrowth (SEG) process to form a source/drain layer in the recess; andreplacing the dummy gate structure with a gate structure.